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      +86(512) 6741 2701  brad.liu@crest-group.net
    Laser Decapsulation System
    LASER DECAPSULATION SYSTEM
    Laser Decapsulation System

    激光IC開瓶器已經推出了PL101I和PL121I,這些型號能夠將銅線IC剝離,也能對超小型封裝進行剝離,不斷追求可用性的提高??梢詮漠斍暗臉藴暑愋蜕壍叫碌?ldquo;i”類型。

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    Plastic Mold Decapsulation System
    塑料模具去封裝系統
    Plastic Mold Decapsulation System

    PS105是一種具有精密酸自動混合功能的塑料模具去封裝系統。這會產生低或無樣品損壞、低成本和高質量的貼紙。

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    Dry Etching System
    干法蝕刻系統
    Dry Etching System

    Dry Decapper ES 312是以反應性離子氣體為主導,對集成電路等電子元器件上的樹脂進行解封的優良系統。
    We can promise the Efficient Dry Decapsulation for 3 samples at once by Automatic Matching and N2 gas regular blowing for residue.
    Automatic Operation up to the end of Decap
    Max 3 samples at once
    High Repeatability Etching

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    汇金门配资多少钱
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